It is Ideal for package interconnects in power modules and for battery pack assembly. Aluminium, copper or nickel ribbons are welded by laser energy at low bond forces. The process offers a larger range of choice in every diverse joining materials, compared to ultrasonic bonding.
Ultrasonic LaserBonder
Applications
Technical Specifications
MACHINE BASE
X-Y-axes Linear encoder resolution better than 0.1 μm
P-axis +/- 180° AC servomotor with absolute encoder, resolution 0.0035°
Z-axis Up to 100 mm, AC servomotor with absolute encoder, resolution 0.5 μm
Positional accuracy < +/-5 μm @ 3 sigma, incl. PRU/Wire/Tool/Application
Repeatability on the product < +/-3 μm @ 3 sigma, incl. PRU/Wire/Tool/Application
Working height According to SMEMA 850-1,050 mm
Monitor 21" flat screen
Certification SEMI S2, CE, Laser Unit Class 1 according to EN 60825-1:2014
Connections SMEMA, USB, RJ 45, Digital I/O
Operating system Real-time, Unix®-based multi-tasking OS
Pattern recognition unit Cognex® PatMax® System
Recognition time Up to 2 ms per pattern recognition
Alignment correction NEW Flexsearch, single point recognition incl. phase angle, two point recognition,
phase angle correction +/- 5 %
Precision Sub-pixel resolution down to 0.1 pixel
Camera Moving CCD-camera, 640 x 480 pixel
Resolution Standard approx. 30 μm per pixel,
adjustable using different optics
Image size Standard 19.2 x 14.4 mm, adjustable using different optics
Illumination Ring light, red, blue, white
Manual work stations From standard size for PCB 4" x 4", 6" x 6", 8" x 6", 10" x 6", 10" x 8"
up to 650 mm x 350mm (25" x 14"),
vacuum and / or mechanical clamping
Automatic parts handling Belt indexer for flat substrates, e. g. ceramic substrates,
PCB or workpiece carriers,
substrate length: flexible, according to requirements; substrate width up to 350 mm
Network connectivity TCP/IP/FTP data exchange,
SMEMA for in-line connections to other machines,
SEMI communication standard SECS/GEM,
MES host connectivity
Documents