Ultrasonic-Laser bonder

The combination of ultrasonic bonding and laser welding offers the best of both worlds. Aluminium, copper or nickel ribbons are welded by laser energy at low bond forces. The process offers a larger range of choice in very diverse joining materials, compared to ultrasonic bonding.


The completely new process, based on laser micro-welding, is particularly suitable for joining bonding wire onto battery terminals and onto DCB substrates and copper terminals in power electronics modules. With Ultrasonic-laser bonding the application of ribbon bonding for much higher currents is accomplished.

Technical Specifications