SERIES 56i is a semiautomatic wire bonder with unbeatable flexibility,changeable bondheads for all wirebond and testing process and anextremely adaptable bond settings, loop shapes, force and power profiles etc.

Applications

Series 56i has Highly sensitive, contactless electronic touchdown sensor which can be digitally controlled and is programmable bond force for delicate component surfaces; the digital ultrasonic generator provides adjustable bond frequencies which makes it ideally suited for aluminum and gold ribbons used for various applications.

Technical Specifications