PermiNex® 1000 is an epoxy based, photo-imageable bonding resist used as an adhesive layer for the definition and capping of cavity structures .PermiNex® 1000 is available in four standard viscosities allowing film thicknesses of 1 to > 25 µm to be achieved in a single coat

Applications

PermiNex® 1000 and 2000 resists are epoxy based, photo-imageable bonding resist used as an adhesive layer for the definition and capping of cavity structures such as BAW, SAW, microfluidic devices, and others where critical alignment, low temperature processing and high bond quality are desired.

Technical Specifications