Expego Split Axis Machine

The EXPEGO is a laser processing workstation designed for high-precision applications in the electronic, precision engineering, and photovoltaic industries. It is mainly used for microvia drilling, cutting (routing), structuring and cavity formation in PCBs with typical dimensions as 610 x 460 mm and 635 x 540 mm.


Via Drilling
PCB Cutting
PCB Structuring
Cavity Formation
Ceramic Scribing
Ceramic Cutting
Ceramic Drilling
Cavity Formation
Wafer Dicing
Selective DBR / Metal Removal
Micro structuring of printing plates