EXPEGO Split Axis Machine is a laser processing workstation designed for microvia drilling, cutting (routing), structuring and cavity formation in PCBs with typical dimensions of 610 x 460 mm and 635 x 540 mm.


Expego Split Axis Machine for high-precision applications in the electronic, precision engineering, and photovoltaic industries, for Micro Via Drilling, Routing, Depaneling, Micro Structuring, Selective Ablation, Cavity Formation.

Technical Specifications