E 460 CMP tool is a semi-automatic system for the polishing and the planarization of wafers. The system is compatible with 4”, 6” and 8” wafers. The tool is equipped with 2 pumps for slurry delivery and an ex-situ conditioning system enabling the user to realise any shape as per the requirement.


The machine can be used for :Wafer optical polishing,Hard materials process for materials like Si, Glass, Quartz, LiNbO3, LiTaO3, PZT,
Si3N4, Langasite, Langatate, Stainless steel

Technical Specifications