"DEFIXX-Series is a versatile tool that is ideal for many R&D wafer debonding applications and low volume production. Its majorly used for the demounting of backside ground, thinned and polished wafers."


The debonding of joined wafers in, has different promising applications for the fabrication of microelectronic devices based on thin, flexible and brittle wafers, for optoelectronic devices like LEDs, solid state lasers or solar cells, as well as for MEMS

Technical Specifications