D9650Z incorporates the latest C-SAM technology with enhanced features to accommodate the testing of Power Modules as well as performing standard C-SAM operations. This new system configuration is used in the optimization of inspection of heatsink bond integrity, thickness of bond layer and wire bond welds.


D9650Z helps in detecting:voids in the die attach, between the die and ceramic substrate insulator,voids between the ceramic substrate and the base plate,thickness of the bond layer,cracks, chips and other defects in the copper clad ceramic substrate,planarity of the die, in the insulator (raft) and the base plate (heatsink).

Technical Specifications