Fabrication of critically aligned 3D structures have been achieved by combining precision alignment procedures and techniques for direct silicon bonding. This produces 3D bonded layers formed in separate prefabricated layers, and is called aligned wafer bonding and it is available as : AWB-04: Wafers up to 150mm AWB-08 : Wafers up to 200mm

Applications

Aligned Wafer Bonders are-Economic(Lowest cost per bond & ownership), have very high reliability with minimal servicing and also have In-situ system provides better reproducibility and therefore better process stability for various MEMS, CMOS Devices and packaging applications.

Technical Specifications