Automatic Wire Bonder (Series 58)

Series 58xx features- exchangeable bond heads,its fully automatic mode makes it ideally suitable for medium-scale production. Parts to be bonded are fed manually, but the bonds produced are automatic.

Applications

Applications are: its commonly used in high frequency and in fine pitch applications; especially high technical industries such as aerospace, can benefit from bonding with 12.5 μm wires.

Technical Specifications