ALIGNER WAFER BONDER

The AWB has the versatility to perform aligned Anodic, Eutectic, Direct (High & Low Temperature) Glass frit, Adhesive, Solder & Thermo-compression wafer bonding.

Applications

Wafer Bonding has found many applications 

- MEMS devices - Pressure Sensors, Accelerometers

- Vacuum Encapsulation 

- Wafer scale packaging - MEMS & IC

- 3D Interconnects and TSV

- Temparory bonds for handle wafers

- Micofluidics

- Smart Cut Layer transfer

Technical Specifications

Documents