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  • Equipments
  • Components
  • Materials
  •     Wire Bonding

    • Manual
    • Wire Bonder F & K M17S
    • Wire Bonder F & K M17XL
    • 5310 Gold-Ball-Bonder
    • 5330 THIN WIRE WEDGE -WEDGE
    • 53xxBDA- BALL-Deep Access
    • 5350 – Heavy-Wire
    • 5350 HR - Heavy Ribbon Bonder
    • 5380 –DIE-Bonder
    • Wire Bonder F & K M17D
    • F&K M17S Ball Wedge
    • Semi-Automatic
    • 5610 GOLD BALL BONDER
    • 5630 THIN WIRE WEDGE BONDER
    • 5632 THIN WIRE DEEP ACCESS BONDER
    • F&S Bondtec 5650-Heavy Wire Wedge-Wedge Bonder
    • 5650 Heavy Ribbon Bonder
    • 5600C Automatic Pull & Shear Tester
    • F&S Bondtec 5810 Ball-wedge Bonder
    • F&S BONDTEC 5830 SEMI-AUTOMATIC BONDER
    • 5832 Deep Access Wedge-wedge Bonder
    • F&S Bondtec 5850 HR Semi -Automatic Heavy Ribbon Bonder
    • Fully-Automatic
    • Wire Bonder F & K M17L
    • 8650-Thick wire
    • 8650HR-Heavy Wire fully automatic
    • 8600C-Automatic Pull & sheertester
  •     Dry Etching

  •     Wafer Grinding and Polishing

  •     Chemical Mechanical Polishing

  •     Wafer Bonding

  •     Die Bonding

  •     Wafer Plating

  •     Package Sealing

  •     Acoustic Scanning Microscope

  •     Resistivity Measurement

  •     Microscopes

  •     In-situ Alignment Wafer Bonding System

  •     Mask Aligners

  •     Electroplating Tools

  •     Spray Solvent Tools

  •     Spin Rinse Dryers

  •     Laser Bonder

  • Thin film Measurement

  • Sputtering Magentrons

  • Wafers

  • PHOTORESISTS

    • E-BEAM RESISTS
    • ma-N 2400
    • mr-PosEBR
    • Lift-Off Resists(LOR)
    • PMMA Positive resists
    • PMGI & LOR
    • Thin Positive Photoresists
    • Positive Thin Photoresists
    • Thick Positive Resists
    • Thick Positive Resists
    • Negative Photoresists
    • Negative Photoresists
  • Electronic Grade Chemicals

  • Photomasks

  • Photoresist Films

  • Sputtering Targets

  • Evaporation Materials and Boats

  • Solid Dopant Sources

  • Alumina Substrates

  • Glass to Metal Packages

  • Ceramic to Metal Packages

  • Ceramic Packages

  • Lids

  • Bonding Wires

  • Storage Boxes

  • IR Glass

  • MicroSpray

  • Hybrid circuits

Wire Bonder F & K M17S
Wire Bonder F & K M17S

Mfr: F&K DELVOTEC, Germany

Wire Bonder F & K M17XL
Wire Bonder F & K M17XL

Mfr: F&K DELVOTEC, Germany

5310 Gold-Ball-Bonder
5310 Gold-Ball-Bonder

Mfr: F&S BONDTEC, Austria

5330 THIN WIRE WEDGE -WEDGE
5330 THIN WIRE WEDGE -WEDGE

Mfr: F&S BONDTEC, Austria

53xxBDA- BALL-Deep Access
53xxBDA- BALL-Deep Access

Mfr: F&S BONDTEC, Austria

5350 – Heavy-Wire
5350 – Heavy-Wire

Mfr: F&S BONDTEC, Austria

5350 HR - Heavy Ribbon Bonder
5350 HR - Heavy Ribbon Bonder

Mfr: F&S BONDTEC, Austria

5380 –DIE-Bonder
5380 –DIE-Bonder

Mfr: F&S BONDTEC, Austria

Wire Bonder F & K M17D
Wire Bonder F & K M17D

Mfr: F&K DELVOTEC, Germany

F&K M17S Ball Wedge
F&K M17S Ball Wedge

Mfr: F&K DELVOTEC, Germany

5610 GOLD BALL BONDER
5610 GOLD BALL BONDER

Mfr: F&S BONDTEC, Austria

 5630 THIN WIRE WEDGE BONDER
5630 THIN WIRE WEDGE BONDER

Mfr: F&S BONDTEC, Austria

5632 THIN WIRE DEEP ACCESS BONDER
5632 THIN WIRE DEEP ACCESS BONDER

Mfr: F&S BONDTEC, Austria

F&S Bondtec 5650-Heavy Wire Wedge-Wedge Bonder
F&S Bondtec 5650-Heavy Wire Wedge-Wedge Bonder

Mfr: F&S BONDTEC, Austria

5650 Heavy Ribbon Bonder
5650 Heavy Ribbon Bonder

Mfr: F&S BONDTEC, Austria

5600C Automatic Pull & Shear Tester
5600C Automatic Pull & Shear Tester

Mfr: F&S BONDTEC, Austria

F&S Bondtec 5810 Ball-wedge Bonder
F&S Bondtec 5810 Ball-wedge Bonder

Mfr: F&S BONDTEC, Austria

F&S BONDTEC 5830 SEMI-AUTOMATIC BONDER
F&S BONDTEC 5830 SEMI-AUTOMATIC BONDER

Mfr: F&S BONDTEC, Austria

 5832 Deep Access Wedge-wedge Bonder
5832 Deep Access Wedge-wedge Bonder

Mfr: F&S BONDTEC, Austria

F&S Bondtec 5850 HR  Semi -Automatic Heavy Ribbon Bonder
F&S Bondtec 5850 HR Semi -Automatic Heavy Ribbon Bonder

Mfr: F&S BONDTEC, Austria

Wire Bonder F & K M17L
Wire Bonder F & K M17L

Mfr: F&K DELVOTEC, Germany

8650-Thick wire
8650-Thick wire

Mfr: F&S BONDTEC, Austria

8650HR-Heavy Wire fully automatic
8650HR-Heavy Wire fully automatic

Mfr: F&S BONDTEC, Austria

8600C-Automatic Pull & sheertester
8600C-Automatic Pull & sheertester

Mfr: F&S BONDTEC, Austria

Aligner Wafer Bonder AWB-04 & AWB-08
Aligner Wafer Bonder AWB-04 & AWB-08

Mfr: AML,UK

T-6000-L/G Flexible High Precision Automatic Die Bonder
T-6000-L/G Flexible High Precision Automatic Die Bonder

Mfr: Tresky,Germany

T-6000-L Flexible Automatic Die Bonder
T-6000-L Flexible Automatic Die Bonder

Mfr: Tresky,Germany

T-8000-G Flexible Automatic Die Bonder
T-8000-G Flexible Automatic Die Bonder

Mfr: Tresky,Germany

FASTLINE™ P300™ C SAM®
FASTLINE™ P300™ C SAM®

Mfr: Nordson Sonoscan,USA

GEN7™ C SAM® ACOUSTIC MICROSCOPE
GEN7™ C SAM® ACOUSTIC MICROSCOPE

Mfr: Nordson Sonoscan,USA

D9600™
D9600™

Mfr: Nordson Sonoscan,USA

CMT-SR1000N
CMT-SR1000N

Mfr: AIT , Korea

CMT-SR2000N / SR2000N-PV
CMT-SR2000N / SR2000N-PV

Mfr: AIT , Korea

CMT-SR3000 (for LCD, OLED, Glass)
CMT-SR3000 (for LCD, OLED, Glass)

Mfr: AIT , Korea

CMT-SR5000 (for 300/450mm wafer)
CMT-SR5000 (for 300/450mm wafer)

Mfr: AIT , Korea

DH2-HISOMET II
DH2-HISOMET II

Mfr: UNION OPTICAL Co.Ltd,JAPAN

EMA-400
EMA-400

Mfr: UNION OPTICAL Co.Ltd,JAPAN

NxQ9000 Series
NxQ9000 Series

Mfr: Neutronix Quintel ,USA

NxQ8000 Series
NxQ8000 Series

Mfr: Neutronix Quintel ,USA

NxQ8012
NxQ8012

Mfr: Neutronix Quintel ,USA

NxQ4000 Series
NxQ4000 Series

Mfr: Neutronix Quintel ,USA

Solstice™ S8 and LT Electroplating Tools
Solstice™ S8 and LT Electroplating Tools

Mfr: Classone Equipments,USA

Trident™ SST Spray Solvent Tools
Trident™ SST Spray Solvent Tools

Mfr: Classone Equipments,USA

Trident™ Spin Rinse Dryers
Trident™ Spin Rinse Dryers

Mfr: Classone Equipments,USA

Ultrasonic Laser Bonder
Ultrasonic Laser Bonder

Mfr: F&K DELVOTEC, Germany

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