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ENQUIRED PRODUCTS
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Wire Bonding
Dry Etching
Wafer Grinding and Polishing
Chemical Mechanical Polishing
Wafer Bonding
Die Bonding
Wafer Plating
Package Sealing
Acoustic Scanning Microscope
Resistivity Measurement
Thin film Measurement
Microscopes
In-situ Alignment Wafer Bonding System
Mask Aligners
Electroplating Tools
Spray Solvent Tools
Spin Rinse Dryers
Laser Bonder
Wafers
PHOTORESISTS
Electronic Grade Chemicals
Photomasks
Photoresist Films
Sputtering Targets
Evaporation Materials and Boats
Solid Dopant Sources
Alumina Substrates
Glass to Metal Packages
Ceramic to Metal Packages
Ceramic Packages
Lids
Bonding Wires
Storage Boxes
IR Glass
MicroSpray
Hybrid circuits
Mfr: F&S BONDTEC, Austria
Your Trusted Microelectronics Solutions Partner
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We thank you for your interest in our products/services.Please share your info to help us to serve you better.