Wire Bonding - Manual - 53xxBDA- BALL-DeepAccess | Equipments

F&S BONDTEC 53XXBDA – BALL- & DEEP ACCESS BONDER

  • c53XX BDA bondhead is the ultimate universal bondhead version. It can be used as a Ballbonder and as well as DA Wedge-Wedge- or DA Ribbon Bonder.
  • Requires minimum training
  • The 53xx is perfectly suited for complex bond tasks.

Wire Bonder F & K M17D
Wire Bonder F & K M17L
Wire Bonder F & K M17S
Wire Bonder F & K M17XL
5310 Gold-Ball-Bonder

Contact Us

Your Trusted Microelectronics Solutions Partner

Phone Number

+91 80 26665684

Email

info[at]gms-india.com

Address

Global Marketing Services
263, 3rd Main, ISRO Layout,
Bangalore – 560078 INDIA.