Equipments - Die Bonding - T-6000-L/G Flexible High Precision Automatic Die Bonder |


T-6000-L/G Flexible High Precision Automatic Die Bonder

  • T-6000-L/G can be upgraded with new loader and unloader modules.
  • The throughput for the latest advanced packaging applications has been extremely improved. With numerous available options, the T-6000-L/G can be customized to suit all market needs.
  • This system offers our customers the opportunity to grow from a manual manufacturing process to a fully automated process without any additional hardware changes.

Contact Us

Your Trusted Microelectronics Solutions Partner

Phone Number

+91 80 26665684

Email

info[at]gms-india.com

Address

Global Marketing Services
263, 3rd Main, ISRO Layout,
Bangalore – 560078 INDIA.