Equipments - Laser Bonder - Ultrasonic Laser Bonder |


Ultrasonic Laser Bonder

  • Extended range of application for precise and reproducible joining of copper or aluminum wire
  • Processing of connectors and bond wires with a diameter of up to 500 μm
  • robust manufacturing process
  • reduced demands on surface quality, cleaning processes and freedom from vibrations of the workpiece compared to wire bonding
  • Bonding on new surfaces and with new materials

Contact Us

Your Trusted Microelectronics Solutions Partner

Phone Number

+91 80 26665684

Email

info[at]gms-india.com

Address

Global Marketing Services
263, 3rd Main, ISRO Layout,
Bangalore – 560078 INDIA.