Wire Bonding - Manual - 5330 THIN WIRE WEDGE -WEDGE | Equipments

F&S Bondtec Thin Wire Wed Bonder – 5330

  • The Wedge-Wedge Bonder 5330 can process aluminium and gold wires from 17,5 to 75 µm.
  • Due to the new designed clamp, it’s possible to bond ribbons up to 125µm width.
  • Due to the mechanical manipulator system the operator can create different kind of loops.
  • The bondhead is equipped with automatic feed- and tail-function, which allows optimal, user-friendly bonding.
  • The handling, supported by a colour display and the input with an shuttle-wheel make the programming of the machine very easy. 

Wire Bonder F & K M17D
Wire Bonder F & K M17L
Wire Bonder F & K M17S
Wire Bonder F & K M17XL
5310 Gold-Ball-Bonder

Contact Us

Your Trusted Microelectronics Solutions Partner

Phone Number

+91 80 26665684

Email

info[at]gms-india.com

Address

Global Marketing Services
263, 3rd Main, ISRO Layout,
Bangalore – 560078 INDIA.