F&S Bondtec Thin Wire Wed Bonder – 5330
- The Wedge-Wedge Bonder 5330 can process aluminium and gold wires from 17,5 to 75 µm.
- Due to the new designed clamp, it’s possible to bond ribbons up to 125µm width.
- Due to the mechanical manipulator system the operator can create different kind of loops.
- The bondhead is equipped with automatic feed- and tail-function, which allows optimal, user-friendly bonding.
- The handling, supported by a colour display and the input with an shuttle-wheel make the programming of the machine very easy.