Materials - Hybrid circuits - Thin Film Substrands |


THIN FILM SUBSTRANDS

  • Thin-film technology uses semiconductor and microsystem technology processes to produce circuit boards on ceramic or organic materials.
  • The metal deposition methods used in vacuum processes, and the flexibility that can be achieved in terms of thickness and type of metallization in particular, really set thin-film technology apart from printed circuit board technology.
  • Interconnection carriers (substrates) in thin-film technology enable extreme connection densities, high-precision geometries of conductors and insulator materials and high thermal conductivity, while offering maximum reliability.

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