Wire Bonding - Manual - 5310 Gold-Ball-Bonder | Equipments

F&S Bondtec Manual Ball Bonder – 5310

  • Entry-level model for bonding gold wires between 17.5 and 50 µm diameter

  • The Gold Ball Bonder 5310 can process gold wires from 17,5 to 50 µm, using the bumping mode as well as the stitch-bond mode

  • Good repeatability due to the motor driven Z-axis

  • Easy to program

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