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F&S Bondtec Manual Ball Bonder – 5310
Entry-level model for bonding gold wires between 17.5 and 50 µm diameter
The Gold Ball Bonder 5310 can process gold wires from 17,5 to 50 µm, using the bumping mode as well as the stitch-bond mode
Good repeatability due to the motor driven Z-axis
Easy to program
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