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At the Bonder only minimum extensions are necessary in hard and software.Instead of the wire bond tool,an adapter is insertedd into the Transducer directly, in order to takeup standard tools for chip bonding,so called Die Collets.
On the market they are avail avle in different Shaft diameters,bit they all fit into the three palnned mounting holes.
The chips are delivered in Wafflepacks,which are mounted beside thr normal substrate holder.
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