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combination of fine and heavy wire in a single process
wire diameters from 17 to 600µm, ribbon dimensions 2.000 x 300µ
rapid and easy conversion in under 15 minutes
compact foot print – occupies less area on the shop floor
continuous monitoring and control of the bond process using the Bond Process Control
comprehensive automation from manual to in-line
Two different wire bonding processes at the same time on one machine, a space saving and safe process for high speed and high quality applications.
Joining Technology Wire Bonding
Your Trusted Microelectronics Solutions Partner