In addition to our 25th anniversary, we were pleased to receive the third productronica Innovation Award in the Future Markets Cluster at Productronica in Munich. At the subsequent award ceremony our managing director Siegfried Seidl, MAS; as well as our colleagues from the Vienna University of Technology, were honored for the development of the BAMFIT test procedure.

Laudatio by Thilo Brückner, VDMA Productronic: The lifetime of heavy wire bonds in power semiconductors is difficult to estimate with accelerated test procedures. The popular Power Cycling (PC) test simulates the load profile of a power device through switching cycles that produce a cyclic, controlled temperature swing at the bond site. The very different thermal expansion of the aluminum bonding wire and silicon substrate on the chip causes a cyclic stress load on the bonding site, which over time, leads to fatigue cracks on and in the bonding interface. Disadvantages of this method are the high outlay on equipment and, above all, the large amount of time required, especially with very reliable connections; even with a short cycle of only 5 seconds, the test lasts at least 6 days

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