Bondtec Accelerated Mechanical Fatigue Interconnect Test
In modern power electronics an enormous amount of heavy-wire bonds are used, which ideally should withstand many years of high thermal cycling. Therefore, special attention is paid to the quality of the bonds. The difficulty with quality assurance is that the life of the bond has to be maximized. However, this is not quite trivial. For this reason, as part of a customer project, we compared the classic sheartest with the patented BAMFIT Test by F&S BONDTEC.