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Wafer Grinding and Polishing
Chemical Mechanical Polishing
Acoustic Scanning Microscope
Thin film Measurement
In-situ Alignment Wafer Bonding System
Spray Solvent Tools
Spin Rinse Dryers
The completely new process based on laser micro-welding is particularly suitable for joining thick bond wire on battery terminals and on DCB substrates and copper terminals in housings of power electronics modules
Mfr: F&K DELVOTEC, Germany
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