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Wafer Grinding and Polishing
Chemical Mechanical Polishing
Acoustic Scanning Microscope
Thin film Measurement
In-situ Alignment Wafer Bonding System
Gold-ball bonding for wires from 17.5 to 50?m
using standard capillaries 16 ?m to 19 ?m
Mfr: F&S BONDTEC, Austria
F&S BONDTEC 5630 Thin Wire Bonder with wedge-wedge bond head processes thin aluminium or gold wires from 17.5 up to 75 µm dia.
Deep Access Bonder for bonding Aluminium/ Gold wires & ribbons - F&S BONDTEC 5632
5650 Heavy wire is Fully PC Controlled and allows any number of bonds to be programmed.
The semi automatic wedge wedge Bonder 5650HR fills the gap between the manual wedge series bonder 53xx to automatic bonder
The automatic bond tester 5600C complements F&S Bondtec Semiconductor GmbH die-and wire-bonders. The PC controlled moving table allows any number of bonds to be tested automatically from a stored program.
F&S Bondtec 5810 - semi-automatic Ball-wedge Bonder is ideal for R&D, Pilot manufacturing and middle volume production.
F&S Bondtec 5830 - semi-automatic THIN WIRE Wedge-wedge Bonder is ideal for R&D, Pilot manufacturing and middle volume production.
F&S Bondtec 5832 – Automatic Deep Access Wedge-wedge Bonder
5850HR Automatic Heavy Ribbon Bonder
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