Gold-ball bonding for wires from 17.5 to 50?m using standard capillaries 16 ?m to 19 ?m controlled
Mfr: F&S BONDTEC, Austria
F&S BONDTEC 5630 Thin Wire Bonder with wedge-wedge bond head processes thin aluminium or gold wires from 17.5 up to 75 µm dia.
Mfr: F&S BONDTEC, Austria
Deep Access Bonder for bonding Aluminium/ Gold wires & ribbons - F&S BONDTEC 5632
Mfr: F&S BONDTEC, Austria
5650 Heavy wire is Fully PC Controlled and allows any number of bonds to be programmed.
Mfr: F&S BONDTEC, Austria
The semi automatic wedge wedge Bonder 5650HR fills the gap between the manual wedge series bonder 53xx to automatic bonder
Mfr: F&S BONDTEC, Austria
The automatic bond tester 5600C complements F&S Bondtec Semiconductor GmbH die-and wire-bonders. The PC controlled moving table allows any number of bonds to be tested automatically from a stored program.
Mfr: F&S BONDTEC, Austria
F&S Bondtec 5810 - semi-automatic Ball-wedge Bonder is ideal for R&D, Pilot manufacturing and middle volume production.
Mfr: F&S BONDTEC, Austria
F&S Bondtec 5830 - semi-automatic THIN WIRE Wedge-wedge Bonder is ideal for R&D, Pilot manufacturing and middle volume production.
Mfr: F&S BONDTEC, Austria
F&S Bondtec 5832 – Automatic Deep Access Wedge-wedge Bonder
Mfr: F&S BONDTEC, Austria
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