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Wafer Grinding and Polishing
Chemical Mechanical Polishing
Acoustic Scanning Microscope
Thin film Measurement
In-situ Alignment Wafer Bonding System
Spray Solvent Tools
Spin Rinse Dryers
F & K M17D is a fully automatic, compact wire bonder to bond fine & heavy wire or heavy ribbon in a single machine.
Mfr: F&K DELVOTEC, Germany
Fully automatic Wire bonder F & K M17L has the largest working area for thin wire bonders with bond heads for deep access, heavy wire or ribbon.
F & K M17S is a fully automatic all-in-one wire bonder - compact, saves space with short process conversion time
Fully automatic Wire bonder F & K M17XL with large workarea can bond large components like battery modules with high accuracy
The Gold Ball Bonder 5310 can process gold wires from 17,5 to 50?m using bumping mode as well as the stitch bond mode.
Mfr: F&S BONDTEC, Austria
F&S Bondtec 5330 Thin Wire Wedge Bonder is widely used in research institutes, R&D labs & for small-scale productions
F&S BONDTEC 53xxBDA- BALL-DeepAccess Bonder is cost-effective & suitable for complex bond tasks
Manual Wire bonder - Bondhead 5350HRC for bonding heavy ribbons & copper wires. Ideal for R & D, prototyping, pilot production & repair.
5350HR - Heavy Ribbon Bonder can process aluminium ribbons up to 2000x300µm and copper wire from 300 to 500µm
Different DIE-sizes process oriented useable and Manual DIE-bonding with Touchdown-Detection and programmable
pickup- and bond force
The M17S Ball-Wedge patented rotating bond head keeps ultrasonic oscillation at the 2nd bond in perfect alignment
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