F & K M17D is a fully automatic, compact wire bonder to bond fine & heavy wire or heavy ribbon in a single machine.
Mfr: F&K DELVOTEC, Germany
Fully automatic Wire bonder F & K M17L has the largest working area for thin wire bonders with bond heads for deep access, heavy wire or ribbon.
Mfr: F&K DELVOTEC, Germany
F & K M17S is a fully automatic all-in-one wire bonder - compact, saves space with short process conversion time
Mfr: F&K DELVOTEC, Germany
Fully automatic Wire bonder F & K M17XL with large workarea can bond large components like battery modules with high accuracy
Mfr: F&K DELVOTEC, Germany
The Gold Ball Bonder 5310 can process gold wires from 17,5 to 50?m using bumping mode as well as the stitch bond mode.
Mfr: F&S BONDTEC, Austria
F&S Bondtec 5330 Thin Wire Wedge Bonder is widely used in research institutes, R&D labs & for small-scale productions
Mfr: F&S BONDTEC, Austria
F&S BONDTEC 53xxBDA- BALL-DeepAccess Bonder is cost-effective & suitable for complex bond tasks
Mfr: F&S BONDTEC, Austria
Manual Wire bonder - Bondhead 5350HRC for bonding heavy ribbons & copper wires. Ideal for R & D, prototyping, pilot production & repair.
Mfr: F&S BONDTEC, Austria
5350HR - Heavy Ribbon Bonder can process aluminium ribbons up to 2000x300µm and copper wire from 300 to 500µm
Mfr: F&S BONDTEC, Austria
Your Trusted Microelectronics Solutions Partner
Phone Number
Email
Address