We thank you for your interest in our products/services.Please share your info to help us to serve you better.
To view your product selections in the future as well as receive updates on latest developments in Micro-electronics, please sign-up.
Login OR Sign-Up
Electronic Grade Chemicals
Evaporation Materials and Boats
Solid Dopant Sources
Glass to Metal Packages
Ceramic to Metal Packages
F&S BONDTEC 5610 Ball Bonder is an universal wire bonder used for processing gold wire from 17,5 to 50 µm thickness.
Mfr: F&S BONDTEC, Austria
F&S BONDTEC 5630 Thin Wire Bonder with wedge-wedge bond head processes thin aluminium or gold wires from 17.5 up to 75 µm dia.
Deep Access Bonder for bonding Aluminium/ Gold wires & ribbons - F&S BONDTEC 5632
F&S Bondtec 5810 - semi-automatic Ball-wedge Bonder is ideal for R&D, Pilot manufacturing and middle volume production.
F&S Bondtec 5830 - semi-automatic THIN WIRE Wedge-wedge Bonder is ideal for R&D, Pilot manufacturing and middle volume production.
F&S Bondtec 5832 – Automatic Deep Access Wedge-wedge Bonder
5850HR Automatic Heavy Ribbon Bonder
5650 Heavy Ribbon Bonder
Your Trusted Microelectronics Solutions Partner