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Electronic Grade Chemicals
Evaporation Materials and Boats
Solid Dopant Sources
Glass to Metal Packages
Ceramic to Metal Packages
F & K M17D is a fully automatic, compact wire bonder to bond fine & heavy wire or heavy ribbon in a single machine.
Mfr: F&K DELVOTEC, Germany
Fully automatic Wire bonder F & K M17L has the largest working area for thin wire bonders with bond heads for deep access, heavy wire or ribbon.
F & K M17S is a fully automatic all-in-one wire bonder - compact, saves space with short process conversion time
Fully automatic Wire bonder F & K M17XL with large workarea can bond large components like battery modules with high accuracy
F&S Bondtec Gold Ball bonder – 5310 is suitable for cost effective bonding of gold wires between 17.5 & 50 µm dia.
Mfr: F&S BONDTEC, Austria
F&S Bondtec 5330 Thin Wire Wedge Bonder is widely used in research institutes, R&D labs & for small-scale productions
F&S BONDTEC 53xxBDA- BALL-DeepAccess Bonder is cost-effective & suitable for complex bond tasks
Manual Wire bonder - Bondhead 5350HRC for bonding heavy ribbons & copper wires. Ideal for R & D, prototyping, pilot production & repair.
5350HR - Heavy Ribbon Bonder
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