F & K M17D is a fully automatic, compact wire bonder to bond fine & heavy wire or heavy ribbon in a single machine.

Fully automatic Wire bonder F & K M17L has the largest working area for thin wire bonders with bond heads for deep access, heavy wire or ribbon.

F & K M17S is a fully automatic all-in-one wire bonder - compact, saves space with short process conversion time

Fully automatic Wire bonder F & K M17XL with large workarea can bond large components like battery modules with high accuracy

F&S Bondtec Gold Ball bonder – 5310 is suitable for cost effective bonding of gold wires between 17.5 & 50 µm dia.

F&S Bondtec 5330 Thin Wire Wedge Bonder is widely used in research institutes, R&D labs & for small-scale productions

F&S BONDTEC 53xxBDA- BALL-DeepAccess Bonder is cost-effective & suitable for complex bond tasks

Manual Wire bonder - Bondhead 5350HRC for bonding heavy ribbons & copper wires. Ideal for R & D, prototyping, pilot production & repair.

5350HR - Heavy Ribbon Bonder

Die-Bonder

F&S BONDTEC 5610 Ball Bonder is an universal wire bonder used for processing gold wire from 17,5 to 50 µm thickness.

F&S BONDTEC 5630 Thin Wire Bonder with wedge-wedge bond head processes thin aluminium or gold wires from 17.5 up to 75 µm dia.

Deep Access Bonder for bonding Aluminium/ Gold wires & ribbons - F&S BONDTEC 5632

5650 Heavy wire is Fully PC Controlled and allows any number of bonds to be programmed.

The semi automatic wedge wedge Bonder 5650HR fills the gap between the manual wedge series bonder 53xx to automatic bonder

The automatic bond tester 5600C complements F&S Bondtec Semiconductor GmbH die-and wire-bonders. The PC controlled moving table allows any number of bonds to be tested automatically from a stored program.

F&S Bondtec 5810 - semi-automatic Ball-wedge Bonder is ideal for R&D, Pilot manufacturing and middle volume production.

F&S Bondtec 5830 - semi-automatic THIN WIRE Wedge-wedge Bonder is ideal for R&D, Pilot manufacturing and middle volume production.

F&S Bondtec 5832 – Automatic Deep Access Wedge-wedge Bonder

5850HR Automatic Heavy Ribbon Bonder

>>Maximum flexibility through working area up to 512 x 720 mm for a variety of applications such as battery bonding >> Expandable on fully automatic bond tester

>>Maximum flexibility through working area up to 512 x 720 mm for a variety of applications such as battery bonding >>Heavy-Ribbon-Bonding of ribbons made of aluminum and copper up to 2 mm width

>> Test heads with exchangeable cartridges >> Camera for automatic testing >> Analysis Software