Bondtec Accelerated Mechanical Fatigue Interconnect Test

Bondtec Accelerated Mechanical Fatigue Interconnect Test

In modern power electronics an enormous amount of heavy-wire bonds are used, which ideally should withstand many years of high thermal cycling. Therefore, special attention is paid to the quality of the bonds. The difficulty with quality assurance is that the life of the bond has to be maximized. However, this is not quite trivial. For this reason, as part of a customer project, we compared the classic sheartest with the patented BAMFIT Test by F&S BONDTEC.
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PLAN OPTIK launches Wafer Universe - off the shelf wafer products

PLAN OPTIK launches Wafer Universe - off the shelf wafer products

In order to serve the high demand of wafers with fixed specifications more quickly, Plan Optik AG has founded a new brand called Wafer Universe, to provide off the shelf products. Therefore every customer can be served with stock products in respond to it‘s needs – simple and fast.
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Ultrasonic wire bonding vs laser welded bonding

Ultrasonic wire bonding vs laser welded bonding

Ultrasonic wire bonding vs laser welded bonding Li-ion cells come in many different shapes and size. There’s also a large variety of options to choose from when designing the connections between each cell and a vehicle’s electronics. In automotive applications, it’s critical to design reliable connections that are cost-effective and suited to high-volume manufacturing.
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