Offer a wide range of materials right from silicon wafers, various substrates, chemicals, packages, etc.
OmniCoat allows easy stripping of hard to remove photoresists and other materials plus improved adhesion
These tweezers are crafted out of stainless steel material which is corrosion resistant in nature.
The clean room wipes have extremely low particles and fiber levels which are ideal for supporting diverse processes in a broad range of critical environments.
Cleanroom gloves are designed to protect either products from contamination or the wearer from exposure to chemicals.
Cleanroom Garments is an overall garment worn in a cleanroom, an environment with a controlled level of contamination.
"EBR PG is specifically formulated to quickly and cleanly remove edge beads that buildup during the spin coat process.
" PMMA is commonly used as a high resolution positive resist for direct write e-beam offering extremely high-resolution.
"LOR and PMGI lift-off resists are based on polydimethylglutarimide (PMGI) polymers and are well suited for a variety of critical and non-critical level lift-off processes.
KMSF® 1000 is a negative tone, polyimide-based photo-dielectric for use as an ultra-low stress buffer, passivation or protective layer.
Needle bonding epoxy is an Optically clear, moisture resistant UV for optical assemblies, encapsulating, and needle bonding.
Epoxy resists consists of chemically amplified, epoxy-based negative resists that are highly functional, and photo-imageable to near UV (365nm)
PermiNex® 1000 is an epoxy based, photo-imageable bonding resist used as an adhesive layer for the definition and capping of cavity structures .
