Offering laser micromachining equipment for cutting various materials like Silicon, Ceramics, PCBs, etc.
LINEXO is a versatile laser processing workstation designed for high-precision applications
EXPEGO Split Axis Machine is a laser processing workstation designed for microvia drilling, cutting (routing), structuring and cavity formation in PCBs
The laser which operates without physical contact and is subject to almost no wear, resulting in extremely low operating costs
Fixed optic or scanner setup Single or dual process heads Process gas (N2,O2,Ar,...) Processing one or more substrates in parallel Automatic camera calibration Automated routines for reference runs Au
Fixed optic or scanner setup Single or dual process heads Process gas (N2, O2, Ar, ...) Processing one or more substrates in parallel Automatic camera calibration Automated routines for referenc
The DIVIDOS with superior ablating technology, set’s the new standard for depaneling of printed circuit board systems. InnoLas, has now once again demonstrated that the DIVIDOS, developed with the la
