Wafer Bonding Services

Wafer Bonding Services

Company: Applied Microengineering Limited (AML), UK

AML’s Bondcentre provides a wealth of wafer bonding experience and the services AML offers are:

Wafer Bonding Process Development e.g. for many novel materials; silicon, glass, sapphire, strained silicon, InP, GaAs, etc.

Wafer Bonding process selection & design for your application

Commercial Wafer Bonding Service prototype to low volume production

Wafer Bonding Technology Transfer (inc Equipment) & Training

Associated Processes (Pre & Post Bond)

AML provides a commercial, fast turn round, Wafer Bonding Service for 2", 3", 4", 6" & 8" wafers. Wafers cleaned and bonded in a class 10 clean room environment

Available In-situ Aligned Wafer Bonding Techniques:

Adhesive
Anodic
Direct (High & Low Temperature Unique RADICAL activation)
Eutectic
Glass Fit
Thermo-compression