The T-6000-L Die Bonder is a fully-automated all-purpose system for medium sized-, pilot- and R&D production.
Equipped with linear motors and 0.1 µm resolution glass scales, this enables a movement precision of 8 µm @ 3Sigma.
A force range of 15g up to 800g, combined with the large working area of 495 x 400 mm and wafer handling up to 8“, offers a wide range of applications. With numerous available options, the T-6000-L can be customized to best suit all market needs.
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