Equipments - Laser Bonder - Ultrasonic Laser Bonder |

Ultrasonic Laser Bonder

  • Extended range of application for precise and reproducible joining of copper or aluminum wire
  • Processing of connectors and bond wires with a diameter of up to 500 μm
  • robust manufacturing process
  • reduced demands on surface quality, cleaning processes and freedom from vibrations of the workpiece compared to wire bonding
  • Bonding on new surfaces and with new materials

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