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Entry-level model for bonding gold wires between 17.5 and 50 µm diameter
The Gold Ball Bonder 5310 can process gold wires from 17,5 to 50 µm, using the bumping mode as well as the stitch-bond mode
Good repeatability due to the motor driven Z-axis
Easy to program
Applications and Benefits
The 5310 is perfect suited for complex bond-tasks,optimal quality and the most favourable price.this machine is the right choice for such applications.
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