Wire Bonding - Manual - Wire Bonder F & K M17L | Equipments

F & K M17L - Fully Automatic Wire Bonder offers:

  • largest working area for thin wire bonders

  • Wire diameters from 17 to 600 µm, ribbons up to 2,000 x 300 µm cross-section

  • Simple and rapid changeover of bond head within 15 minutes

  • Bond heads for deep access, heavy wire or heavy ribbon bonding

Application and benefits

Highest flexibility with combined manual and automatic parts handling:
Two manual work holders or single track indexer with manual work holder or Dual track indexer with bond-off station.

Joining Technology Wire Bonding

  • Wedge-Wedge Fine Wire
  • Deep Access Wedge-Wedge Fine Wire
  • Wedge-Wedge Heavy Wire
  • Wedge-Wedge Heavy Ribbon


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Contact Us

Your Trusted Microelectronics Solutions Partner

Phone Number

+91 80 26665684




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263, 3rd Main, ISRO Layout,
Bangalore – 560078 INDIA.