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largest working area for thin wire bonders
Wire diameters from 17 to 600 µm, ribbons up to 2,000 x 300 µm cross-section
Simple and rapid changeover of bond head within 15 minutes
Bond heads for deep access, heavy wire or heavy ribbon bonding
Highest flexibility with combined manual and automatic parts handling:
Two manual work holders or single track indexer with manual work holder or Dual track indexer with bond-off station.
Joining Technology Wire Bonding
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