Wire Bonding - Manual - Wire Bonder F & K M17D | Equipments

F & K M17D Two Head Automatic Wire Bonder offers:

  • combination of fine and heavy wire in a single process

  • wire diameters from 17 to 600µm, ribbon dimensions 2.000 x 300µ

  • rapid and easy conversion in under 15 minutes

  • compact foot print – occupies less area on the shop floor

  • continuous monitoring and control of the bond process using the Bond Process Control

  • comprehensive automation from manual to in-line

Applications and Benefits

Two different wire bonding processes at the same time on one machine, a space saving and safe process for high speed and high quality applications.

Joining Technology Wire Bonding

  • Wedge-Wedge Fine Wire
  • Deep Access Wedge-Wedge Fine Wire
  • Wedge-Wedge Heavy Wire
  • Wedge-Wedge Heavy Ribbon


Laser Bonder | Wire Bonding

Wire Bonder F & K M17L

Laser Bonder | Wire Bonding

Wire Bonder F & K M17S

Laser Bonder | Wire Bonding

Wire Bonder F & K M17XL

Laser Bonder | Wire Bonding

5310 Gold-Ball-Bonder

Laser Bonder | Wire Bonding


Contact Us

Your Trusted Microelectronics Solutions Partner

Phone Number

+91 80 26665684




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263, 3rd Main, ISRO Layout,
Bangalore – 560078 INDIA.