Wire Bonding - Manual - Wire Bonder F & K M17S | Equipments


Wire Bonder F & K M17S – the first and only fully automatic all-in-one bonder in the world.

  • M17 benefits from an innovative platform strategy with a number of work areas, whereby the different wirebond technologies and transducer frequencies can be deployed on the same machine base.
  • Integrated thin wire and deep access applications in a single machine platform through fast system change-over
  • Solutions for any customer requirements from prototyping to series manufacture
  • Ensures repeatable bond quality through patented BPC for real-time adjustment of the bond parameters with varying material surfaces
  • Ensures process transparency through seamless integration in industry 4.0/IOT procedures
  • Shortens set-up times through intelligent pattern recognition with multiple structure and feature identification

Applications and benefits

A process safe, all-in-one bonder for any demanding wire bonding process, particularly suitable for ball-wedge bonding in packages (deep access). 

Joining Technology  Wire Bonding

  • Wedge-Wedge Fine Wire
  • Deep Access Wedge-Wedge Fine Wire
  • Wedge-Wedge Heavy Wire
  • Wedge-Wedge Heavy Ribbon

Laser Bonder | Wire Bonding

Wire Bonder F & K M17L


Laser Bonder | Wire Bonding

Wire Bonder F & K M17XL


Laser Bonder | Wire Bonding

5310 Gold-Ball-Bonder


Laser Bonder | Wire Bonding

5330 THIN WIRE WEDGE -WEDGE


Contact Us

Your Trusted Microelectronics Solutions Partner

Phone Number

+91 80 26665684

Email

info[at]gms-india.com

Address

Global Marketing Services
263, 3rd Main, ISRO Layout,
Bangalore – 560078 INDIA.