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Wafer Grinding and Polishing
Chemical Mechanical Polishing
Scanning Acoustic Microscope
Thin film Measurement
In-situ Alignment Wafer Bonding System
F&S BONDTEC 5610 Ball Bonder is an universal wire bonder used for processing gold wire from 17,5 to 50 µm thickness.
Mfr: F&S BONDTEC, Austria
F&S BONDTEC 5630 Thin Wire Bonder with wedge-wedge bond head processes thin aluminium or gold wires from 17.5 up to 75 µm dia.
Deep Access Bonder for bonding Aluminium/ Gold wires & ribbons - F&S BONDTEC 5632
F&S Bondtec 5810 - semi-automatic Ball-wedge Bonder is ideal for R&D, Pilot manufacturing and middle volume production.
F&S Bondtec 5830 - semi-automatic THIN WIRE Wedge-wedge Bonder is ideal for R&D, Pilot manufacturing and middle volume production.
F&S Bondtec 5832 – Automatic Deep Access Wedge-wedge Bonder
5850HR Automatic Heavy Ribbon Bonder
5650 Heavy Ribbon Bonder
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