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Wafer Grinding and Polishing
Chemical Mechanical Polishing
Scanning Acoustic Microscope
Thin film Measurement
In-situ Alignment Wafer Bonding System
F&S BONDTEC 53XX BALL DEEP-ACCESS BONDER is cost-effective & suitable for complex bond tasks
Mfr: F&S BONDTEC, Austria
F&S Bondtec Manual Ball bonder – 5310 is suitable for cost effective bonding of gold wires between 17.5 & 50 µm dia.
F&S Bondtec 5330 Thin Wire Wedge Bonder is widely used in research institutes, R&D labs & for small-scale productions
Manual Wire bonder - Bondhead 5350HRC for bonding heavy ribbons & copper wires. Ideal for R & D, prototyping, pilot production & repair.
5350HR - Heavy Ribbon Bonder
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