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Wafer Grinding and Polishing
Chemical Mechanical Polishing
Scanning Acoustic Microscope
Thin film Measurement
In-situ Alignment Wafer Bonding System
F & K M17D is a fully automatic, compact wire bonder to bond fine & heavy wire or heavy ribbon in a single machine.
Mfr: F&K DELVOTEC, Germany
Fully automatic Wire bonder F & K M17L has the largest working area for thin wire bonders with bond heads for deep access, heavy wire or ribbon.
F & K M17S is a fully automatic all-in-one wire bonder - compact, saves space with short process conversion time
Fully automatic Wire bonder F & K M17XL with large workarea can bond large components like battery modules with high accuracy
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