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Wafer Grinding and Polishing
Chemical Mechanical Polishing
Scanning Acoustic Microscope
Thin film Measurement
In-situ Alignment Wafer Bonding System
F & K M17D is a fully automatic, compact wire bonder to bond fine & heavy wire or heavy ribbon in a single machine.
Mfr: F&K DELVOTEC, Germany
Fully automatic Wire bonder F & K M17L has the largest working area for thin wire bonders with bond heads for deep access, heavy wire or ribbon.
F & K M17S is a fully automatic all-in-one wire bonder - compact, saves space with short process conversion time
Fully automatic Wire bonder F & K M17XL with large workarea can bond large components like battery modules with high accuracy
F&S BONDTEC 53XX BALL DEEP-ACCESS BONDER is cost-effective & suitable for complex bond tasks
Mfr: F&S BONDTEC, Austria
F&S Bondtec Manual Ball bonder – 5310 is suitable for cost effective bonding of gold wires between 17.5 & 50 µm dia.
F&S Bondtec 5330 Thin Wire Wedge Bonder is widely used in research institutes, R&D labs & for small-scale productions
Manual Wire bonder - Bondhead 5350HRC for bonding heavy ribbons & copper wires. Ideal for R & D, prototyping, pilot production & repair.
5350HR - Heavy Ribbon Bonder
F&S BONDTEC 5610 Ball Bonder is an universal wire bonder used for processing gold wire from 17,5 to 50 µm thickness.
F&S BONDTEC 5630 Thin Wire Bonder with wedge-wedge bond head processes thin aluminium or gold wires from 17.5 up to 75 µm dia.
Deep Access Bonder for bonding Aluminium/ Gold wires & ribbons - F&S BONDTEC 5632
F&S Bondtec 5810 - semi-automatic Ball-wedge Bonder is ideal for R&D, Pilot manufacturing and middle volume production.
F&S Bondtec 5830 - semi-automatic THIN WIRE Wedge-wedge Bonder is ideal for R&D, Pilot manufacturing and middle volume production.
F&S Bondtec 5832 – Automatic Deep Access Wedge-wedge Bonder
5850HR Automatic Heavy Ribbon Bonder
5650 Heavy Ribbon Bonder
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