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Bondtec Accelerated Mechanical Fatigue Interconnect Test

Bondtec Accelerated Mechanical Fatigue Interconnect Test

In modern power electronics an enormous amount of heavy-wire bonds are used, which ideally should withstand many years of high thermal cycling. Therefore, special attention is paid to the quality of the bonds. The difficulty with quality assurance is that the life of the bond has to be maximized. However, this is not quite trivial. For this reason, as part of a customer project, we compared the classic sheartest with the patented BAMFIT Test by F&S BONDTEC.
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PLAN OPTIK launches Wafer Universe - off the shelf wafer products

PLAN OPTIK launches Wafer Universe - off the shelf wafer products

In order to serve the high demand of wafers with fixed specifications more quickly, Plan Optik AG has founded a new brand called Wafer Universe, to provide off the shelf products. Therefore every customer can be served with stock products in respond to it‘s needs – simple and fast.
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Ultrasonic wire bonding vs laser welded bonding

Ultrasonic wire bonding vs laser welded bonding

Ultrasonic wire bonding vs laser welded bonding Li-ion cells come in many different shapes and size. There’s also a large variety of options to choose from when designing the connections between each cell and a vehicle’s electronics. In automotive applications, it’s critical to design reliable connections that are cost-effective and suited to high-volume manufacturing.
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Productronica Innovation Award in Future Market Cluster

Productronica Innovation Award in Future Market Cluster

In addition to our 25th anniversary, we were pleased to receive the third productronica Innovation Award in the Future Markets Cluster at Productronica in Munich. At the subsequent award ceremony our managing director Siegfried Seidl, MAS; as well as our colleagues from the Vienna University of Technology, were honored for the development of the BAMFIT test procedure.
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BAMFIT (Bondtec Accelerated Mechanical Fatigue Interconnect Test)

BAMFIT (Bondtec Accelerated Mechanical Fatigue Interconnect Test)

In the shear test, the force [cN] is determined which is necessary to destroy the bond contact. In the BAMFIT test, the time until the contact is detached is measured and converted into the number of mechanical oscillation cycles (LoadCycles) on the basis of the applied excitation frequency. Both variables, shear force and LoadCycles, quantify the mechanical load capacity of the bond contacts close to the interface zone.
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