E400 E Chemical Mechanical Polishing System for R&D

E400 E Chemical Mechanical Polishing System for R&D

Company: Alpsitec, France

The E400 E is designed for polishing and planarization of single wafers with diameters between 1″ and 4″. A new carrier technology opens the range to smaller sizes but also any shape products: square: 10x10mm, quarter of wafers

The optimal use of E400 E is in the field of research and development application, new material development