E460 Chemical Mechanical Polishing System
Company: Alpsitec, France
The E460 is designed for polishing and planarization of single wafers with diameters between 1″ and 8″. The optimal use of E460 is in the field of research and development application as well as small scale production requirements due to the machine’s flexibility.
Solutions for the polishing of small-sized samples: 10mmx10mm, 15mmx15mm, 1 “, quarter of 2 “. Any shape can be realized.