Company: Applied Microengineering Limited (AML), UK
Wafer Sizes: 3” – 6”
Alignment and Bonding in one system
Possible to do all types of permanent bonding like Anodic, Direct, Eutectic, Glass Frit, Adhesive, Solder and Thermo-Compression.
Possible to do temporary bonding with special adhesives from AML
Possible to have Aligned Polymer Micro Hot Embossing / Nano imprinting.
In-situ alignment 1 micron accuracy
10-6mbar Vacuum to 2bar process gas.
Voltage up to 2.5kV
Temperature up to 5600C
Forces up to 25kN
In-situ UV cure
Fast bonding cycle times / high throughput