AMB-04 In-situ

AMB-04 In-situ Wafer Aligner and Bonder for MEMS, Microfluidics, 3D Integration and WLP

Company: Applied Microengineering Limited (AML), UK

Wafer Sizes: 3” – 6”

Alignment and Bonding in one system

Possible to do all types of permanent bonding like Anodic, Direct, Eutectic, Glass Frit, Adhesive, Solder and Thermo-Compression.

Possible to do temporary bonding with special adhesives from AML

Possible to have Aligned Polymer Micro Hot Embossing / Nano imprinting.

Key Features:

In-situ alignment 1 micron accuracy

10-6mbar Vacuum to 2bar process gas.

Voltage up to 2.5kV

Temperature up to 5600C

Forces up to 25kN

In-situ UV cure

Fast bonding cycle times / high throughput